|
|
|
|
|
Hi Henry. Please make STB part test plan for Mass production and OBA test plan and update this mantis Please let us know draft release date. Thanks SON |
|
2021-01-25 09:31 developer |
|
|
|
Hi SH, Plz find attached the test plan FYI Thanks Henry |
|
|
Hi Henry. We will review it and feedback to you with until this week (0000024:0000001/29) thanks SON |
|
|
Hi SH, I'd like to update the test flow as the factory re-arranged the order for the concern of production efficiency. Thanks, Henry |
|
|
Hi Henry Here is VI draft spec for SWAN. if you have any question, please let me know Thanks SON |
|
|
Hi SH, We will check it and get back to you later. Plz confirm if we apply the VI from DVT3 for housing? Thanks Henry |
|
|
Hi Henry the spec effectivity (need to apply date) is in the document at first - BFX-UA300 first mass production Please proceed visual inspection in DVT3, but please skip the pass or fail judgment. just noticed status to us. Thanks SON |
|
|
Hi Dennis Please feedback about this inspection criteria until this week (7/2) Thanks SON |
|
|
|
|
|
Hi Dennis Here is SWAN manufacturing specification draft version please check and review about this spec Thanks SON |
|
|
Hi Dennis, Sean Remind this ticket. please check it. |
|
|
Hi SH : Please help to check and confirm some issue: 1. MIC part: The void solder should be less than 25% Please help to check and confirm: How will it impact to function of product? If yes, please help to confirm whether our testing program cover this issue or not. Now we aren't still solve void solder issue. and we can't scanX-RAY 100% in MP stage. Also, please help to advise us how to improve this issue. 2. Assembly Gap spec: From DVT1-DVT3 build, We met Gap between housing over spec ( Customer waivered to use) Please help to check and modify spec better. 3. Rubber on bottom case deformed: Because our product is too long and tolerance of material/ assembly are not good lead to the front cover is assembled not well: The rubber isn't filled into the hole on front cover well Please help to check and improve design. 4. Button key is jammed. This issue was happened will all of DVT1-DVT3 build. We don't see any improvement from RD/Customer. 5. Housing is designed as smooth surface without any thing to protect housing. So that, housing is easily dirty, scratched,... Please check whether can modify to use rough surface for housing. Else, please check how to protect housing. 6. Screw boss is damaged when drive screw, especial if we apply srew torque as customer's request. - Please help to check and modify design & srew torque 7. Assembly has interference: - Power cable & Heat spreader AMP top --> Risk: Drive Screw not well - CPU& Heat spreader SOC-TOP --> Risk: CPU cracked - Capacitors & heat spreader SOC-Bottom. --> Risk: short issue Please help to check and modify design asap. 8. Tolerance for sticking is so tight: 3+/-0.5mm Tolerance of top cover : +/-0.2mm Tolerance of bottom cover : +/-0.2mm Tolerance of fixture: +/-0.3mm Tolerance of assembly, manipulation Please check with customer to change spec. With other customer, spec to sticking label is +/-2mm. Please referance. 9. Currently, we assemble MIC FFC cable hard because the cable is short. Now, RD request to wrap cable around ferrite core without modify length of cable --> FFC cable is very short --> We assemble cable very difficultly and have high risk to assemble FFC cable not well. Please check and modify design PleaseTake sample to verify well before request factory do as that. There are some important issues need to improve before DVT4 build online. Also, please help to check other issues as DFM report to manufacturing of factory more conveniently. SWAN check and improve design.png (70,477 bytes) |
|
|
Hi Dennis here is feedback to you. It would be better if you add more photos and drawings. 1. There's a problem with reliability. also this is not a negotiable item with the customer And please solve it yourself. The FII did not provide the detail information what I requested. because FII said that is confidential. Please prove and guarantee that void doesn't happen. Then, I'll update the manufacturing specification. 2. Check based on DVT3 and tell me where there is a problem 3. Feedback to Vender. 4. Check DFM feedback from JIM 5. Check DFM feedback from JIM 6. Screw torque will give Jim feedback. check with JIM 7. discuss with FII. Not ALT 8. KC label - other product is meet the customer request, why this product can not meet the spec? Housing Tolerance : will feedback to you 9. discuss with FII. Not ALT Thanks SON |
|
|
I attached the comment from CFT for Visual inspection criteria and Manufacturing Specification. |
|
|
4.1.1 Visual inspection "This inspection criteria following the 4.1 Cosmetic criteria. Including accessary package." FII Feedback BFX-UA300 is too long and heavy, OP cannot shake the product to check abnormality inside of it. Need customer define specs/method to check abnormalliti inside of product Are there any alternatives plan for check abnormality inside to the factory besides ALT define? I think the right order is to come up with the alternatives plan first and then make the decision. Thanks SON |
|
|
Hi SH, Please find the comment from our factory as below. In our normal process, we scan all of accessory and check the weight to prevent missing accessory. 1. We scan the bar cod of all accessories in packing station. 2. Before packing into carton, we also have a station to check the weight. Therefore, if there is any shoratge that our OP forget to pack the accessory, the DUT will be blocked in checking weight station. This failure DUT also won't be packed into the next station, packing carton station. |
|
|
HI Sheila Tu my point is "product inside'. not in gift/carton packing. Stuff inside is not allowed in the sound area -i.g. screw or bushing, already factory made the same kind of issue. so that's why I request that to prevent the same problem. FII should be make the plan for prevent stuff inside the product Thanks SON |
|
|
Updated SWAN teat plan and OBA plan. |
|
|
Hi Sheila 0001126:0008033 Please update the shaking test on SET level. Not only soundbar but also normally STB, this is critical to quality Thanks SON |
|
|
Hi SH, From our point of view, the shaking test that you asked could not prevent it because not all components inside of DUT are solidification. The correct action that we shall do is to follow BOM list, which means no unacceptable materials, and SOP, which means no unacceptable process to control it. |
|
|
Hi Sheila, The purpose of shaking test are 1. To check there is any unfixed components in the soundbar, such as bushing, ferrite core, cable etc. We think that it may happen during the assembly. And it can make some rub and noise. 2. To check there is any other additional component in the soundbar, such as screw, ferrite core etc. It can make electrical short and noise. As you know there are many small components in our Soundbar. So we are worried about it. If electrical short may happen in customer's house, then it should be those issue may happen, then we(ALT/Foxconn) should indemnify and pay penalty to Korean Government. If there is no need to check it, then let me know how you can avoid it. |
|
|
Hi Mr. Yoon, As your word, there are many unfixed components in the soundbar. Because there are unfixed components, OP might always hears the voice and cannot judge it's caused by unacceptable materials or acceptable materials. From our point of view, it's meaningless to shake the soundbar. The key items that we shall do is to follow BOM list, which means no unacceptable materials, and SOP, which means no unacceptable process to control it. |
|
|
Hi Carey Please check and update test plan of SWAN if there are any changes 0001126:0008162 Also, Please make a report with detailed pictures for "how to test of LED after assembly" - FT1 : Check LED (white , off) - Front LED x 22 pcs (Nugu, Google, Status) and each Side LED (2pcs) = Total 26pcs Thanks SON |
|
|
Hi Carey Here is inspection criteria updated. Please find the attachment file Thanks SON |
|
|
HI SH, Please help to send it via email directly and include factory team next time as they cannot access Mantis. Thanks in advance~ |
|
|
Hi SH, Please see attached for Swan test plan and LED check items. Thanks. BR, Carey |
|
|
Hi Carey Thank you for update. the LED test is to checked by operator manually. and Also, please make production process same as Eagle. production process document have to include the test plan. https://mantis.cnsbg.foxconn.com/vaas/view.php?id=1396#c8847 Please upload by December 9th. Thanks SON |
|
2021-12-09 15:59 no access |
|
|
|
HI SH, Please refer to attached file. Thanks. |
|
|
HI Carey. first of all, thank you for the update Please see my feedback and update again 1. SMT : SWAN BGA (VS-550) is 0.4mm pitch BGA. please check again 2. What is the difference between Wavesoldering and PTH ? 3. please write all the letters : PTH, UK, FT, RC, VI, IPQC, CQA 4. add the OBA Station Test Items 5. It would be better to added step-by-step factory photos Thanks SON |
|
|
Hi SH, Please see attached file for updated manufacturing process. 1)What is the difference between Wavesoldering and PTH ? PTH=Plate Through Hole After components are plated through hole by hand, it must go through wavesoldering stage. 2)please write all the letters : PTH, UK, FT, RC, VI, IPQC, CQA PTH Plate Through Hole UK Unlock Key FT Function Test RC Read Code VI Visual Inspection IPQC In Process Quality Control CQA Customer Quality Assurance BR, Carey |
|
|
HI Carey Thank you for update Thanks SON |
|
|
document revision |
|
|
HI An, I update the OBA report format : add x-ray inspection result row. Thanks SON |
|
|
Hi SH Son Got it, i have sent it to our team. Thanks |
|
|
Hi An and Rachel. Here is updated Manufacturing specification and inspection criteria. Please refer to the below documents. if you have any question, please contact me. |
|
|
HI SH Son I update the OBA report add x-ray inspection result on 2000 pcs shipping 20220906. Thanks Rachel |
- yk.jung ( (ALTech) Younkwang Jung ) developer
